472
IPEC 472 CMP
Description | |
Maker | IPEC |
MODEL | 472 |
Content | The IPEC 472 uses a CMP polishing process that removes virtually any semiconductor material using polishing slurry to planarize the wafers to achieve flatness, uniformity and planarization on patterned/device wafers. The wafer polisher provides: fully automated precision polishing, processing flexibility and repeatable results. Condition: Used, AS-IS/ fully refurbished. Wafer Sizes: 2 inch, 3 inch, 100 mm, 125 mm, 150 mm and 200 mm |